Fraunhofer IVV at interpack 2026: Holistic Technologies for Sustainable Processing and Innovative Packaging Concepts
Press release from 26.02.2026
From May 7–13, 2026, the Fraunhofer Institute for Process Engineering and Packaging IVV will showcase how the packaging industry can successfully navigate fundamental transformations and complex challenges at interpack 2026 in Düsseldorf, located at the VDMA booth in Hall 4, Stand C54. The institute will present packaging solutions that meet mandatory recycling content requirements, along with technologies for designing new, safe, sustainable, and efficient packaging systems.
Fraunhofer Institute for Environmental, Safety and Energy Technology UMSICHT